半导体封装应用工程师

职位类别： 产品研发工程师

Job Responsibility：
1.	Customer pre-sales support
	Provide technical expertise to customer for reflow processes and other Heating processes in Various   Semi-conductor Industry  
	Analyze and improve customers reflow process include troubleshooting
	External acceptance and process support
	Provide process acceptance external
	Contribute test trials for customer include full report
	Carry out process training to customer
2.	Coordination with HQ
	Work close together with HQ application department for continues improvement
	Condenso support for HQ on request after training
	Collect process data from customer to help to improve their processes Reporting
	weekly report to CTO and GM on request
3.	 After-sales support
	Support service team during evaluation and demo at customer side
	Assist for reflow / condenso and Installation
	Support in China and Aisa team and travel to customer on request
(Work over-time may be necessary subject to the assigned task)

Job Requirement:
1.	Technical college/university education background majored in microelectronic packaging, mechanical engineering, automation engineering微电子封装、机械工程、自动化工程专业；
2.	2+ years of semiconductor packaging development or manufacturing experience有两年从事半导体封装开发或生产制造经验； 
3.	Good knowledge in the principles, methods and process of IC eutectic bonding, wafer bonding and gold wire bonding 掌握芯片共晶焊接，晶圆焊接和金丝引线键合的原理、方法及工艺；
4.	Proficiency in using computer-aided design tools such as AutoCAD熟练使用AutoCAD等计算机辅助设计工具；
5.	Understand the properties of heat conduction and its application in Semiconductor devices理解热传导的特性和其在半导体器件中的应用。
6.	Good written, reading and oral English and Chinese良好的中英文口语能力。
7.	Experience in the development, manufacturing and maintenance of mechatronic equipment is preferred有从事机电一体化设备开发、制造、维修经验者优先。

• 年龄要求： 不限
• 语言要求：不限